Liquid supply unit, and substrate treating apparatus including the same

ABSTRACT

Provided is a liquid supply unit for supplying a treatment liquid to a nozzle that discharges the treatment liquid to a substrate, the liquid supply unit including: a tank for storing the treatment liquid; a main circulation line for supplying the treatment liquid from an internal space of the tank to the nozzle or for recovering the treatment liquid to the internal space of the tank; a supply line connected to the main circulation line to supply the treatment liquid to the nozzle; and a heater module installed in the main circulation line and heating the treatment liquid flowing through the main circulation line to a predetermined temperature, in which the heater module includes: a pipe in which the treatment liquid flows and which is made of a quartz material; and a heating element provided on a surface of the pipe.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit of Korean PatentApplication No. 10-2021-0170437 filed in the Korean IntellectualProperty Office on Dec. 1, 2021, the entire contents of which areincorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a liquid supply unit, and a substratetreating apparatus including the same.

BACKGROUND ART

Contaminants, such as particles, organic contaminants, and metalcontaminants, remaining on the surface of the substrate greatly affectthe characteristics and production yield of semiconductor devices. Forthis reason, a cleaning process of removing various contaminantsadhering to the surface of the substrate is very important in thesemiconductor manufacturing process, and a process of cleaning thesubstrate is performed before and after each unit process ofmanufacturing a semiconductor.

In general, the cleaning process of the substrate includes a chemicaltreatment process for removing metal foreign substances, organicsubstances and/or particles remaining on the substrate by supplyingchemicals to the substrate that is supported and rotated by a supportunit, a rinse process in which pure water is supplied to the substrateto remove the chemicals remaining in the substrate acid, a substitutionprocess of supplying an organic solvent, such as an isopropyl alcohol(IPA) solution, to the substrate to replace the pure water on thesubstrate with the organic solvent, and a drying process of removing thesubstituted organic solvent from the substrate. In this case, theliquids supplied onto the substrate may be provided by being heated to apredetermined temperature.

In order to supply a high-temperature liquid to the substrate, a heatermodule for heating the liquid is used. In general, a heater moduleincludes a pipe based on fluororesin, such as PFA and PTFE, and aheating element (heat source) based on a metal, such as aluminum,stainless steel, and nickel-chromium (Ni—Cr). In this case, heattransfer is performed in the order of the heating element, a heattransfer core, the pipe, and a liquid, and there are many heat transfersteps, so there is a problem that the temperature increase efficiency islowered.

In addition, the metal-based heating element continuously transmitshigh-temperature heat to the fluororesin-based pipe, thereby causingdamage to the pipe. Damage to the pipe may cause contamination of theliquid flowing therein, and there is a problem in that the risk ofoccurrence of liquid leakage of the heater module increases.

In addition, the fluororesin-based pipe has absorption and permeationproperties, allowing particulate to migrate from the heating element. Inthis case, there is a problem in that the heated liquid is contaminatedby metal particles generated from the metal-based heating element.

SUMMARY OF THE INVENTION

The present invention has been made in an effort to provide a liquidsupply unit capable of increasing temperature increase efficiency byminimizing a heat transfer step in supplying a high-temperaturetreatment liquid, and a substrate treating apparatus including the same.

The present invention has also been made in an effort to provide aliquid supply unit capable of preventing damage to a pipe through whicha treatment liquid flows therein in a heater module heating thetreatment liquid to a predetermined temperature, and a substratetreating apparatus including the same.

The present invention has also been made in an effort to provide aliquid supply unit capable of preventing a treatment liquid from beingcontaminated by metal particles while the treatment liquid is heated toa predetermined temperature by a heater module, and a substrate treatingapparatus including the same.

The object of the present invention is not limited thereto, and otherobjects not mentioned will be clearly understood by those of ordinaryskill in the art from the following description.

An exemplary embodiment of the present invention provides an apparatusfor treating a substrate, the apparatus including: a chamber having aprocessing space; a support unit for supporting and rotating thesubstrate in the processing space; a nozzle for supplying ahigh-temperature treatment liquid to the substrate supported by thesupport unit; and a liquid supply unit for supplying thehigh-temperature treatment liquid to the nozzle, in which the liquidsupply unit includes: a tank for storing the treatment liquid; a maincirculation line for supplying the treatment liquid from an internalspace of the tank to the nozzle or for recovering the treatment liquidto the internal space of the tank; and a connection line connected tothe main circulation line to supply the treatment liquid to the nozzle,and a heater module for heating the treatment liquid to a predeterminedtemperature is installed in the main circulation line, and the heatermodule includes: a pipe in which the treatment liquid flows and which ismade of a quartz material; and a heating element provided on a surfaceof the pipe.

The heating element may be provided on the surface of the pipe in aprinting manner.

The heater module may include a conductor terminal provided on thesurface of the pipe, and a terminal block which is coupled onto theconductor terminal and receives power from the outside, and at least aportion of the conductor terminal may be in contact with the heatingelement.

The heating element may include a first portion extending in alongitudinal direction of the pipe while being in contact with thesurface of the pipe, a second portion extending upwardly from the firstportion, and a third portion extending in the longitudinal direction ofthe pipe from the second portion, the second portion may be in contactwith one end of the conductor terminal, and the third portion may be incontact with the surface of the conductor terminal.

The heater module may include the heating element and an insulatorcovering an exposed portion of the heating element.

The conductor terminal and the terminal block may be electricallyconnected through a conductive adhesive.

The heating element and the conductor terminal may be made of metal.

The heating element may be made of AgPd or graphite, the conductorterminal may be made of with silver (Ag), and the conductive adhesivemay be provided as a silver paste (Ag sintering).

The insulator may be made of silicon dioxide (SiO₂).

The main circulation line may include a supply line for supplying thetreatment liquid stored in the internal space of the tank to the nozzle,and a recovery line for recovering the treatment liquid from the nozzleto the tank, and the heater module may be installed in the supply line.

The heater module may include a temperature sensor for measuring atemperature of the heating element.

The liquid supply unit may include an internal circulation line forcirculating the treatment liquid stored in the internal space of thetank, and the heater module may be installed in the internal circulationline.

The treatment liquid may be provided as isopropyl alcohol (IPA).

Another exemplary embodiment of the present invention provides a liquidsupply unit for supplying a treatment liquid to a nozzle that dischargesthe treatment liquid to a substrate, the liquid supply unit including: atank for storing the treatment liquid; a main circulation line forsupplying the treatment liquid from an internal space of the tank to thenozzle or for recovering the treatment liquid to the internal space ofthe tank; a supply line connected to the main circulation line to supplythe treatment liquid to the nozzle; and a heater module installed in themain circulation line and heating the treatment liquid flowing throughthe main circulation line to a predetermined temperature, in which theheater module includes: a pipe in which the treatment liquid flows andwhich is made of a quartz material; and a heating element provided on asurface of the pipe.

The heater module may include a conductor terminal provided on thesurface of the pipe, and a terminal block which is coupled onto theconductor terminal and receives power from the outside, and at least aportion of the conductor terminal may be in contact with the heatingelement.

The conductor terminal may be provided on the surface of the pipe in acylindrical printing manner, and the conductor terminal and the terminalblock may be electrically connected through a conductive adhesive.

The heating element may include a first portion extending in alongitudinal direction of the pipe while being in contact with thesurface of the pipe, a second portion extending upwardly from the firstportion, and a third portion extending in the longitudinal direction ofthe pipe from the second portion, the second portion may be in contactwith one end of the conductor terminal, and the third portion may be incontact with the surface of the conductor terminal.

The heater module may include the heating element and an insulatorcovering a contact portion between the heating element and the conductorterminal.

Still another exemplary embodiment of the present invention provides anapparatus for treating a substrate, the apparatus including: a chamberhaving a processing space; a support unit for supporting and rotatingthe substrate in the processing space; a nozzle for supplying ahigh-temperature treatment liquid to the substrate supported by thesupport unit; and a liquid supply unit for supplying thehigh-temperature treatment liquid to the nozzle, in which the liquidsupply unit includes: a first tank and a second tank for storing thetreatment liquid; a main circulation line for connecting the first tankand the second tank and supplying the treatment liquid to the nozzle orrecovering the treatment liquid to an internal space of the first tankor an internal space of the second tank; and an internal circulationline for connecting the first tank and the second tank and heating thetreatment liquid contained in the internal space of the first tank orthe internal space of the second tank, the main circulation lineincludes a supply line branched from the main circulation line andsupplying the treatment liquid to the nozzle, and a recovery linebranched from the main circulation line and recovering the treatmentliquid from the nozzle to the first tank or the second tank, the innercirculation line includes a lower circulation line connecting a lowerwall of the first tank and a lower wall of the second tank, an uppercirculation line connecting an upper wall of the first tank and an upperwall of the second tank, and a shared line connecting the lowercirculation line and the upper circulation line, a heater module forheating the treatment liquid flowing therein to a predeterminedtemperature is installed in each of the supply line of the maincirculation line and the shared line of the internal circulation line,and the heater module includes: a pipe in which the treatment liquidflows and which is made of a quartz material; a heating element providedon a surface of the pipe in a printing manner; a conductor terminalwhich is provided on the surface of the pipe in a printing manner, andat least a portion of which is in contact with the heating element; anda terminal block which is coupled onto the conductor terminal through aconductive adhesive and receives power from the outside.

The heater module may include an insulator covering an exposed portionof the heating element.

According to the exemplary embodiment of the present invention, the heattransfer operation in supplying a high-temperature treatment liquid maybe minimized, thereby increasing the temperature increase efficiency.

Further, according to the exemplary embodiment of the present invention,in the heater module for heating the treatment liquid to a predeterminedtemperature, damage to the pipe through which the treatment liquid flowsmay be prevented.

Further, according to the exemplary embodiment of the present invention,it is possible to minimize the risk of leakage of the heater module.

Further, according to the exemplary embodiment of the present invention,it is possible to prevent the treatment liquid from being contaminatedby metal particulates while the treatment liquid is heated to apredetermined temperature by the heater module.

The effect of the present invention is not limited to the foregoingeffects, and the not-mentioned effects will be clearly understood bythose skilled in the art from the present specification and theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view schematically illustrating a substrateprocessing facility according to an exemplary embodiment of the presentinvention.

FIG. 2 is a cross-sectional view illustrating a substrate treatingapparatus of FIG. 1 .

FIG. 3 is a view schematically illustrating the liquid supply unit ofFIG. 2 .

FIG. 4 is a perspective view of a heater module according to theexemplary embodiment of the present invention.

FIG. 5 is a cross-sectional view of a heater module according to theexemplary embodiment of the present invention.

FIG. 6 is a diagram schematically illustrating a process in which atreatment liquid is supplied from a first tank to a nozzle according tothe exemplary embodiment of the present invention.

FIG. 7 is a diagram schematically illustrating a process in which atreatment liquid is supplied from a second tank to a nozzle according tothe exemplary embodiment of the present invention.

DETAILED DESCRIPTION

Hereinafter, an exemplary embodiment of the present invention will bedescribed more fully hereinafter with reference to the accompanyingdrawings, in which exemplary embodiments of the invention areillustrated. However, the present invention can be variously implementedand is not limited to the following exemplary embodiments. In thefollowing description of the present invention, a detailed descriptionof known functions and configurations incorporated herein is omitted toavoid making the subject matter of the present invention unclear. Inaddition, the same reference numerals are used throughout the drawingsfor parts having similar functions and actions.

Unless explicitly described to the contrary, the word “comprise” andvariations such as “comprises” or “comprising” will be understood toimply the inclusion of stated elements but not the exclusion of anyother elements. It will be appreciated that terms “including” and“having” are intended to designate the existence of characteristics,numbers, operations, operations, constituent elements, and componentsdescribed in the specification or a combination thereof, and do notexclude a possibility of the existence or addition of one or more othercharacteristics, numbers, operations, operations, constituent elements,and components, or a combination thereof in advance.

Singular expressions used herein include plurals expressions unless theyhave definitely opposite meanings in the context. Accordingly, shapes,sizes, and the like of the elements in the drawing may be exaggeratedfor clearer description.

Terms, such as first and second, are used for describing variousconstituent elements, but the constituent elements are not limited bythe terms. The terms are used only to discriminate one constituentelement from another constituent element. For example, without departingfrom the scope of the invention, a first constituent element may benamed as a second constituent element, and similarly a secondconstituent element may be named as a first constituent element.

It should be understood that when one constituent element referred to asbeing “coupled to” or “connected to” another constituent element, oneconstituent element can be directly coupled to or connected to the otherconstituent element, but intervening elements may also be present. Incontrast, when one constituent element is “directly coupled to” or“directly connected to” another constituent element, it should beunderstood that there are no intervening element present. Otherexpressions describing the relationship between the constituentelements, such as “between ~” and “just between ~” or “adjacent to and“directly adjacent to ~” should be interpreted similarly.

All terms used herein including technical or scientific terms have thesame meanings as meanings which are generally understood by thoseskilled in the art unless they are differently defined. Terms defined ingenerally used dictionary shall be construed that they have meaningsmatching those in the context of a related art, and shall not beconstrued in ideal or excessively formal meanings unless they areclearly defined in the present application.

The apparatus of the present exemplary embodiment may be used to performa cleaning process on a circular substrate. However, the technicalspirit of the present invention is not limited thereto, and may be usedin various types of processes for supplying a treatment liquid to thesubstrate while rotating the substrate. Hereinafter, a case in which awafer is used as a substrate will be described as an example.

Hereinafter, an exemplary embodiment of the present invention will bedescribed in detail with reference to the drawings.

FIG. 1 is a cross-sectional view schematically illustrating a substrateprocessing facility according to an exemplary embodiment of the presentinvention.

Referring to FIG. 1 , a substrate processing facility 1 may include anindex module 10 and a process processing module 20. The index module 10may include a load port 120 and a transfer frame 140. The load port 120,the transfer frame 140, and the process processing module 20 may besequentially arranged in series. Hereinafter, a direction in which theload port 120, the transfer frame 140, and the process processing module20 are arranged is called to as a first direction 12, and a directionperpendicular to the first direction 12 when viewed from the top iscalled a second direction 14, and a direction perpendicular to a planeincluding the first direction 12 and the second direction 14 is called athird direction 16.

A carrier F in which a substrate W is accommodated is seated on the loadport 120. The load port 120 is provided in plurality, and the pluralityof load ports 120 may be arranged in series in the second direction 14.In FIG. 1 , it is illustrated that four load ports 120 are provided, butthe number of load ports 120 may be increased or decreased according toprocess efficiency of the process processing module 20 and a conditionof foot print, and the like. A slot (not illustrated) provided tosupport the edge of the substrate may be formed in the carrier F. Aplurality of slots may be provided in the third direction 16, and thesubstrates may be disposed in the carrier F to be stacked apart fromeach other along the third direction 16. As the carrier F, a FrontOpening Unified Pod (FOUP) may be used.

The transfer frame 140 may carry the substrate W between the carrier Fthat is seated on the load port 120 and the buffer unit 220. Thetransfer frame 140 may be provided with an index rail 142 and an indexrobot 144. A longitudinal direction of the index rail 142 is provided tobe parallel to the second direction 14. The index robot 144 may beinstalled on the index rail 142. The index robot 144 is linearly movablein the second direction 14 along the index rail 142. The index robot 144includes a base 144 a, a body 144 b, and an index arm 144 c. The base144 a is installed to be movable along the index rail 142. The body 144b is coupled to the base 144 a. The body 144 b may be provided to bemovable in the third direction 16 on the base 144 a. Further, the body144 b may be provided to be rotatable on the base 144 a. The index arm144 c is coupled to the body 144 b and is provided to be movableforwardly and backwardly with respect to the body 144 b. A plurality ofindex arms 144 c may be provided to be individually driven. The indexarms 144 c are disposed to be stacked in the state of being spaced apartfrom each other in the third direction 16. A part of the index arms 144c may be used when the substrate W is carried from the processprocessing module 20 to the carrier F, and another part of the pluralityof index arms 144 c may be used when the substrate W is carried from thecarrier 130 to the process processing module 20. This may prevent theparticles generated from the substrate W before the process processingfrom being attached to the substrate W after the process processing inthe process in which the index robot 144 loads and unloads the substrateW.

The process processing module 20 may include a buffer unit 20, atransfer chamber 240, and a process chamber 260.

The buffer unit 220 may be disposed between the transfer frame 140 andthe transfer chamber 240. The buffer unit 220 provides a space in whichthe substrate W stays before the substrate W is transferred between thetransfer chamber 240 and the transfer frame 140. A slot (notillustrated) in which the substrate W is placed is provided inside thebuffer unit 220, and a plurality of slots (not illustrated) may beprovided so as to be spaced apart from each other in the third direction16. In the buffer unit 220, a surface facing the transfer frame 140 anda surface facing the transfer chamber 240 may be opened.

The transfer chamber 240 may transfer the substrate W between the bufferunit 220 and the process chamber 260. A guide rail 242 and a main robot244 are provided to the transfer chamber 240. The guide rail 242 isdisposed so that its longitudinal direction is parallel to the firstdirection 12. The main robot 244 is installed on the guide rail 242 andlinearly moved along the first direction 12 on the guide rail 242.

The transfer chamber 240 may disposed so that a longitudinal directionthereof is parallel to the first direction. The process chambers 260 maybe disposed on both sides of the transfer chamber 240 in the seconddirection 14. The process chambers 260 may be provided to be symmetricalto each other with respect to the transfer chamber 240. Some of theprocess chambers 260 may be disposed along the longitudinal direction ofthe transfer chamber 240. Also, some of the process chambers 260 may bedisposed to be stacked on each other. That is, the process chambers 260may be disposed in an arrangement of A × B (A and B are natural numbersequal to or greater than 1) at both sides of the transfer chamber 240.Here, A is the number of process chambers 260 provided in a line alongthe first direction 12, and B is the number of process chambers 260provided in a line along the third direction 16. When four or sixprocess chambers 260 are provided at one side of the transfer chamber240, the process chambers 260 may be disposed in an arrangement of 2 × 2or 3 × 2. The number of process chambers 260 may be increased ordecreased.

Unlike the foregoing, the process chamber 260 may be provided only toone side of the transfer chamber 240. In addition, the process chamber260 may be provided as a single layer on one side and the other side ofthe transfer chamber 240. In addition, the process chamber 260 may beprovided in various arrangements unlike the above.

The process chamber 260 disposed on one side of the transfer chamber 240may perform the same process as the process chamber 260 disposed on theother side of the transfer chamber 240. For example, a process ofliquid-processing the substrate W may be performed in the processchamber 260. Alternatively, the process chamber 260 disposed on one sideof the transfer chamber 240 may perform a different process from theprocess chamber 260 disposed on the other side of the transfer chamber240. For example, a liquid processing process may be performed in theprocess chamber 260 disposed on one side of the transfer chamber 240,and a substrate drying process may be performed in the process chamber260 disposed on the other side 280 of the transfer chamber 240.

Hereinafter, the substrate treating apparatus 300 provided in theprocess chamber 260 will be described. In the present exemplaryembodiment, the case where the substrate treating apparatus 300 performsa liquid processing process on the substrate will be described as anexample. The liquid processing process includes a process of cleaningthe substrate.

FIG. 2 is a cross-sectional view illustrating the substrate treatingapparatus of FIG. 1 . Referring to FIG. 2 , the substrate treatingapparatus 300 includes a chamber 310, a processing vessel 320, a spinhead 340, a lifting unit 360, a liquid discharge unit 400, an airflowforming unit 500, a liquid supply unit 600, and a controller 900. Thechamber 310 may provide a processing space 312 in which a process forprocessing the substrate W is performed.

The processing vessel 320 is located in the processing space 312 and maybe provided in a cup shape with an open top. When viewed from the top,the processing vessel 320 may be positioned to overlap an exhaust pipe542. The processing vessel 320 may include an internal recoverycontainer 322 and an external recovery container 326. Each of therecovery containers 322 and 326 may recover different treatment liquidsfrom among the treatment liquids used in the process. The internalrecovery container 322 may be provided in an annular ring shapesurrounding the spin head 340, and the external recovery container 326may be provided in an annular ring shape surrounding the internalrecovery container 322. Each of an internal space 322 a of the internalrecovery container 322 and a space 326 a between the external recoverycontainer 326 and the internal recovery container 322 may be an inletthrough which the treatment liquid is introduced into the internalrecovery container 322 and the external recovery container 326. Recoverylines 322 b and 326 b extending vertically downwards from the bottoms ofthe recovery containers 322 and 326 may be connected to the recoverycontainers 322 and 326, respectively. The recovery lines 322 b and 326 bmay be discharge pipes for discharging the treatment liquid introducedthrough the recovery containers 322 and 326. The discharged treatmentliquid may be reused through an external treatment liquid regenerationsystem (not illustrated).

The spin head 340 is provided as a substrate support unit 340 thatsupports and rotates the substrate W. The spin head 340 may be disposedwithin the processing vessel 320. The spin head 340 may support thesubstrate W and rotate the substrate W during the process. The spin head340 may include a body 342, a support pin 344, a chuck pin 346, and asupport shaft 348. The body 342 may have a top surface that is providedas a generally circular shape when viewed from above. The support shaft348 rotatable by a motor 349 may be fixedly coupled to the bottomsurface of the body 342. A plurality of support pins 344 may beprovided. The support pins 344 may be spaced apart from each other at apredetermined interval in an edge region of the upper surface of thebody 342 and protrude upwardly from the body 342. The support pins 334may be disposed to have an annular ring shape as a whole by combinationwith each other. The support pin 344 may support the bottom edge of thesubstrate W so that the substrate W is spaced apart from the uppersurface of the body 342 by a predetermined distance. A plurality ofchuck pins 346 may be provided. The chuck pin 346 may be disposedfarther from the center of the body 342 than the support pin 344. Thechuck pin 346 may be provided to protrude upwardly from the body 342.The chuck pin 346 may support the side portion of the substrate W sothat the substrate W is not laterally separated from the originalposition when the spin head 340 is rotated. The chuck pin 346 may beprovided to be linearly movable between a standby position and a supportposition along the radial direction of the body 342. The standbyposition may be a position farther from the center of the body 342 thanthe support position. When the substrate W is loaded or unloaded fromthe spin head 340, the chuck pin 346 may be positioned at the standbyposition, and when a process is performed on the substrate W, the chuckpin 346 may be positioned at the support position. In the supportingposition, the chuck pin 346 may be in contact with the side portion ofthe substrate W.

The lifting unit 360 may adjust a relative height between the processingvessel 320 and the spin head 340. The lifting unit 360 may linearly movethe processing vessel 320 in the vertical direction. The relative heightof the processing vessel 320 with respect to the spin head 340 may bechanged as the processing vessel 320 moves in the vertical direction.The lifting unit 360 may include a bracket 362, a moving shaft 364, anda driver 366. The bracket 362 may be fixedly installed on an outer wallof the processing vessel 320. The bracket 362 may be fixed to the movingshaft 364 that is moved in the vertical direction by the driver 366. Thelifting unit 360 may lower the processing vessel 320 so that the spinhead 340 protrudes upwardly from the processing vessel 320 when thesubstrate W is placed on or lifted from the spin head 340. In addition,when the process is performed, the lifting unit 360 may adjust a heightof the processing vessel 320 so that the treatment liquid may beintroduced into the set recovery containers 322 and 326 according to thetype of the treatment liquid supplied to the substrate W.

Unlike the above, the lifting unit 360 may move the spin head 340 in thevertical direction instead of the processing vessel 320.

The liquid discharge unit 400 may discharge various types of liquidsonto the substrate W. The liquid discharge unit 400 may include aplurality of nozzles 410 to 430. Each of the nozzles 410 to 430 may bemoved to a process position and a standby position. Here, the processposition is a position at which the nozzles 410 to 430 may discharge theliquid onto the substrate W located in the processing vessel 320, andthe standby position is a position where the nozzles 410 to 430 are outof the process position and wait. According to an example, the processposition may be a position at which the nozzles 410 to 430 may supply aliquid to the center of the substrate W. For example, when viewed fromthe top, the nozzles 410 to 430 may be moved linearly or axially to bemoved between the process position and the standby position.

The plurality of nozzles 410 to 430 may discharge different types ofliquids. The liquid discharged from the nozzles 410 to 430 may include achemical, a rinse liquid, and a drying fluid. Referring to the exemplaryembodiment of FIG. 2 , a first nozzle 410 may be a nozzle fordischarging chemicals. A second nozzle 420 may be a nozzle thatdischarges a rinse liquid. A third nozzle 430 may be a nozzle thatdischarges a drying fluid. For example, the chemical may be a liquidcapable of etching a film formed on the substrate W or removingparticles remaining on the substrate W. The chemical may be a liquidhaving a property of a strong acid or a strong base. The chemical mayinclude sulfuric acid, hydrofluoric acid, or ammonia. The rinse liquidmay be a liquid capable of rinsing the chemicals remaining on thesubstrate W. For example, the rinse liquid may be pure water. The dryingfluid may be provided as a liquid capable of replacing the residualrinse liquid on the substrate W. The drying fluid may be a liquid havinglower surface tension than the rinse liquid. The drying fluid may be anorganic solvent. The drying fluid may be isopropyl alcohol (IPA). Thethird nozzle 430 may be connected to the liquid supply unit 600 to bedescribed later.

The airflow forming unit 500 may form a downdraft in the processingspace 312. The airflow forming unit 500 may supply an airflow from anupper portion of the chamber 310 and exhaust the airflow from a lowerportion of the chamber 310. The airflow forming unit 500 may include anairflow supply unit 520 and an exhausting unit 540. The airflow supplyunit 520 and the exhaust unit 540 may be disposed to face each othervertically.

The airflow supply unit 520 may supply gas in a downward direction. Thegas supplied from the airflow supply unit 520 may be air from whichimpurities are removed. The airflow supply unit 520 may include a fan522, an airflow supply line 524, a supply valve 528, and a filter 526.The fan 522 may be installed on the ceiling surface of the chamber 310.When viewed from above, the fan 522 may be positioned to face theprocessing vessel 320. The fan 522 may supply air toward the substrate Wpositioned in the processing vessel 320. The airflow supply line 524 maybe connected to the fan 522 to supply air to the fan 522. The supplyvalve 528 may be installed in the airflow supply line 524 to adjust thesupply amount of the airflow. The filter 526 may be installed in theairflow supply line 524 to filter the air. For example, the filter 526may remove particles and moisture contained in the air.

The exhaust unit 540 may exhaust the processing space 312. The exhaustunit 540 may include an exhaust pipe 542, an exhaust line 544, adecompressing member 546, and an exhaust valve 548. The exhaust pipe 542is installed on the bottom surface of the chamber 310 and may beprovided as a pipe for exhausting the processing space 312. The exhaustpipe 542 may be positioned such that an exhaust port faces upwardly. Theexhaust pipe 542 may be positioned such that the exhaust portcommunicates with the interior of the processing vessel 310. That is,the upper end of the exhaust pipe 542 may be located in the processingvessel 320. Accordingly, the downdraft formed in the processing vessel320 may be exhausted through the exhaust pipe 542. An exhaust line 544may be connected to the exhaust pipe 542. The decompressing member 546and the exhaust valve 548 may be installed in the exhaust line 544.

The decompressing member 546 may decompress pressure of the exhaust pipe542. A negative pressure may be formed in the exhaust pipe 542 by thedecompressing member 546, which may exhaust the processing vessel 320.The exhaust valve 548 is installed in the exhaust pipe 542, and may openand close the exhaust port of the exhaust pipe 542. The exhaust valve548 may adjust the amount of exhaust.

FIG. 3 is a view schematically illustrating the liquid supply unit ofFIG. 2 .

The liquid supply unit 600 may include a first tank 610. The first tank610 may have an internal space 611. The first tank 610 may be providedin a cylindrical shape in which the internal space 611 is formed. Thetreatment liquid may be contained in the internal space 611 of the firsttank 610. An organic solvent may be contained in the first tank 610.Isopropyl alcohol (IPA) may be contained in the first tank 610. Thefirst tank 610 may receive a treatment liquid from a liquid supplysource 630 to be described later. The first tank 610 may be connected tothe liquid supply source 630 through a first branch supply line 632 tobe described later. The first tank 610 may receive the treatment liquidfrom the liquid supply source 630 through the first branch supply line632 to be described later.

A temperature adjusting member (not illustrated) may be included in thefirst tank 610. The temperature adjusting member may be installed in theinternal space 611 of the first tank 610. The temperature adjustingmember may be installed to be submerged in the treatment liquidcontained in the first tank 610. The temperature adjusting member mayadjust the temperature of the treatment liquid contained in the firsttank 610. However, the present invention is not limited thereto, and atemperature adjusting member may not be provided inside the first tank610.

A sensor (not illustrated) may be disposed in the internal space 611 ofthe first tank 610. The sensor may detect the residual amount oftreatment liquid contained in the internal space 611 of the first tank610.

The first tank 610 may include a first discharge line 612. The firstdischarge line 612 may be connected to a lower wall of the first tank610. The first discharge line 612 may discharge the treatment liquidcontained in the internal space 611 of the first tank 610 to theoutside. For example, when the treatment liquid contained in the firsttank 610 is contaminated or it is time to replace the treatment liquid,the treatment liquid contained in the internal space 611 of the firsttank 610 may be discharged to the outside through the first dischargeline 612. A valve 613 may be installed in the first discharge line 612.The valve 613 may be provided as an on/off valve. The valve 613 mayadjust whether or not to discharge the treatment liquid contained in theinternal space 611 of the first tank 610 or the amount of treatmentliquid discharged. For example, when the discharge of the treatmentliquid contained in the first tank 610 is not required, the valve 613 ismaintained in a closed state, and when the treatment liquid contained inthe first tank 610 is discharged, the valve 613 may be maintained in anopen state.

The liquid supply unit 600 may include a second tank 620. The secondtank 620 may have an internal space 621. The second tank 620 may beprovided in a cylindrical shape in which the internal space 621 isformed. The treatment liquid may be contained in the internal space 621of the second tank 620. The second tank 620 may contain the sametreatment liquid as the treatment liquid contained in the first tank610. An organic solvent may be contained in the second tank 620.Isopropyl alcohol (IPA) may be contained in the second tank 620. Thesecond tank 620 may receive a treatment liquid from the liquid supplysource 630 to be described later. The second tank 620 may be connectedto the liquid supply source 630 through a second branch supply line 633to be described later. The second tank 620 may receive the treatmentliquid from the liquid supply source 630 through the second branchsupply line 633 to be described later.

A temperature adjusting member (not illustrated) may be included insidethe second tank 620. The temperature adjusting member may be installedin the internal space 621 of the second tank 620. The temperatureadjusting member may be installed to be submerged in the treatmentliquid contained in the second tank 620. The temperature adjustingmember may adjust the temperature of the treatment liquid contained inthe second tank 620. However, the present invention is not limitedthereto, and a temperature adjusting member may not be provided insidethe second tank 620.

A sensor (not illustrated) may be disposed in the internal space 621 ofthe second tank 620. The sensor may detect the residual amount oftreatment liquid contained in the internal space 621 of the second tank620.

The second tank 620 may include a second discharge line 622. The seconddischarge line 622 may be connected to a lower wall of the second tank620. The second discharge line 622 may discharge the treatment liquidcontained in the internal space 621 of the second tank 620 to theoutside. For example, when the treatment liquid contained in the secondtank 620 is contaminated or it is time to replace the treatment liquid,the treatment liquid contained in the internal space 621 of the secondtank 620 may be discharged to the outside through the second dischargeline 622. A valve 623 may be installed in the second discharge line 622.The valve 623 may be provided as an on/off valve. The valve 623 maycontrol whether or not to discharge the treatment liquid contained inthe internal space 621 of the second tank 620 or the amount of treatmentliquid discharged. For example, when it is not necessary to dischargethe treatment liquid contained in the second tank 620, the valve 623 ismaintained in a closed state, and when the treatment liquid contained inthe second tank 620 is discharged, the valve 623 may remain open.

In the exemplary embodiment of FIG. 3 , it is illustrated as the liquidsupply unit 600 includes two tanks (the first tank 610 and the secondtank 620 ), but the present invention is not limited thereto. Forexample, the liquid supply unit 600 may include only one tank.Alternatively, the liquid supply unit 600 may include three or moretanks. The liquid supply unit 600 may include a various number of tanksaccording to process efficiency, the type of the treatment liquid, thetemperature condition of the treatment liquid, and the like.

The liquid supply unit 600 may include a liquid supply source 630. Thetreatment liquid may be stored in the liquid supply source 630. Anorganic solvent may be stored in the liquid supply source 630. Isopropylalcohol (IPA) may be stored in the liquid supply source 630. The liquidsupply source 630 may supply the treatment liquid to a tank connected tothe liquid supply source 630. In the exemplary embodiment of FIG. 3 ,the liquid supply source 630 may supply the treatment liquid to thefirst tank 610 and/or the second tank 620.

An integrated supply line 631 may be connected to the liquid supplysource 630. The integrated supply line 631 may be a passage forsupplying the treatment liquid to the plurality of tanks when the liquidsupply source 630 is connected to the plurality of tanks.

The integrated supply line 631 may be connected to the first tank 610.The integrated supply line 631 may be connected to the first tank 610through the first branch supply line 632 branched from the integratedsupply line 631. The liquid supply source 630 may be connected to thefirst tank 610 through the integrated supply line 631 and the firstbranch supply line 632. The treatment liquid stored in the liquid supplysource 630 may be supplied to the first tank 610 through the integratedsupply line 631 and the first branch supply line 632. A valve 633 may beinstalled in the first branch supply line 632. The valve 633 may beinstalled on the side of the first tank 610 based on a branch point ofthe integrated supply line 631 and the first branch supply line 632. Thevalve 633 may be installed downstream from the liquid supply source 630in a direction toward the first tank 610 based on the branch point ofthe integrated supply line 631 and the first branch supply line 632. Thevalve 633 may be provided as an on/off valve. The valve 633 may adjustthe supply amount of treatment liquid supplied to the first tank 610.

The integrated supply line 631 may be connected to the second tank 620.The integrated supply line 631 may be connected to the second tank 620through the second branch supply line 634 branched from the integratedsupply line 631. The liquid supply source 630 may be connected to thesecond tank 620 through the integrated supply line 631 and the secondbranch supply line 634. The treatment liquid stored in the liquid supplysource 630 may be supplied to the second tank 620 through the integratedsupply line 631 and the second branch supply line 634. A valve 635 maybe installed in the second branch supply line 634. The valve 635 may beinstalled on the side of the second tank 620 based on a branch point ofthe integrated supply line 631 and the second branch supply line 634.The valve 635 may be installed downstream from the liquid supply source630 in a direction toward the second tank 620 based on the branch pointof the integrated supply line 631 and the second branch supply line 634.The valve 635 may be provided as an on/off valve. The valve 635 mayadjust a supply amount of treatment liquid supplied to the second tank620.

Meanwhile, in the exemplary embodiment of FIG. 3 , it is illustratedthat one liquid supply source 630 is included, and one liquid supplysource 630 supplies the treatment liquid to the first tank 610 and thesecond tank 620, but the present invention is not limited thereto. Forexample, the liquid supply source 630 may include a plurality of liquidsupply sources. For example, the liquid supply source 630 may beprovided in a number corresponding to the number of tanks, and oneliquid supply source may be connected to one tank.

The liquid supply unit 600 may include a main circulation line 640. Themain circulation line 640 may circulate the treatment liquid containedin the first tank 610. The main circulation line 640 may circulate thetreatment liquid contained in the second tank 620. The main circulationline 640 may supply the treatment liquid to the third nozzle 430 fromthe internal space 611 of the first tank 610 or recover the treatmentliquid to the internal space 611 of the first tank 610. The maincirculation line 640 may supply the treatment liquid to the third nozzle430 from the internal space 621 of the second tank 620 or recover thetreatment liquid to the internal space 621 of the second tank 620.Connection lines 661 and 662 for supplying the treatment liquid to thethird nozzle 430 may be connected to the main circulation line 640. Theconnection lines 661 and 662 may include a plurality of connection lines661 and 662. The plurality of connection lines 661 and 662 may beconnected to a plurality of third nozzles 430 provided in the pluralityof processing chambers. On/off valves 663 and 664 may be installed inthe plurality of connection lines 661 and 662, respectively. Thetreatment liquid circulating in the main circulation line 640 may supplythe treatment liquid to the third nozzle 430 through connection lines661 and 662. Through this, the third nozzle 430 may supply the treatmentliquid to the substrate W. In the exemplary embodiment of FIG. 3 , theconnection lines 661 and 662 and the third nozzle 430 are illustrated astwo, but this is only an example, and the number of connection lines 661and 662 and third nozzle 430 may be variously designed according to thenumber of chambers provided in the substrate processing facility or thecapacity of the tank.

The main circulation line 640 may include a supply line 641. The supplyline 641 may be connected to the lower wall of the tank. The supply line641 may include a first supply line 6411 connected to the lower wall ofthe first tank 610. The supply line 641 may include a second supply line6412 connected to the lower wall of the second tank 620. The supply line641 may include a third supply line 6413 connected to a first point P1where the first supply line 6411 and the second supply line 6412 meet.One end of the third supply line 6413 may be connected to the firstpoint P1, and the other end of the third supply line 6413 may beconnection points where the main supply line 640 and the connectionlines 661 and 662 are connected.

A valve 6414 may be installed in the first supply line 6411. The valve6414 may be provided as an on/off valve. The valve 6414 may be installedbetween the connection point of the first tank 610 and the first supplyline 6411 and the first point P1. The valve 6414 may be maintained in anopen state when the treatment liquid is supplied from the first tank 610to the third nozzle 430. The valve 6141 may be maintained in a closedstate when the treatment liquid is not supplied from the first tank 610to the third nozzle 430. For example, the valve 6141 may be maintainedin a closed state when the treatment liquid is supplied from the secondtank 620 to the third nozzle 430. Also, the valve 6141 may be maintainedin an open state when the treatment liquid is not supplied from thesecond tank 620 to the third nozzle 430. The treatment liquid containedin the first tank 610 may be supplied to the third nozzle 430 throughthe first supply line 6411, the third supply line 6413, and theconnection lines 661 and 662.

A valve 6415 may be installed in the second supply line 6412. A valve6415 may be installed in the second supply line 6412. The valve 6415 maybe provided as an on/off valve. The valve 6415 may be installed betweenthe connection point of the second tank 620 and the second supply line6412 and the first point P1. The valve 6415 may be maintained in an openstate when the treatment liquid is supplied from the second tank 620 tothe third nozzle 430. The valve 6145 may be maintained in a closed statewhen the treatment liquid is not supplied from the second tank 620 tothe third nozzle 430. For example, the valve 6145 may be maintained in aclosed state when the treatment liquid is supplied from the first tank610 to the third nozzle 430. Also, the valve 6141 may be maintained inan open state when the treatment liquid is not supplied from the firsttank 610 to the third nozzle 430. The treatment liquid contained in thesecond tank 620 may be supplied to the third nozzle 430 through thesecond supply line 6412, the third supply line 6413, and the connectionlines 661 and 662.

The main circulation line 640 may include a recovery line 642. Therecovery line 642 may be connected to the upper wall of the tank. Therecovery line 642 may include a first recovery line 6421 connected tothe upper wall of the first tank 610. The recovery line 642 may includea second recovery line 6422 connected to the upper wall of the secondtank 620. The recovery line 642 may include a third recovery line 6423connected to a second point P2 where the first recovery line 6421 andthe second recovery line 6422 meet. One end of the third recovery line6423 may be connected to the second point P2, and the other end of thethird recovery line 6423 may be connection points C1 and C2 where themain supply line 640 and the connection lines 661 and 662 are connected.That is, the connection points C1 and C2 may be branch points at whichthe connection lines 661 and 662 branch from the main supply line 640.Also, the connection points C1 and C2 may be junctions where the thirdsupply line 6413 and the third recovery line 6423 meet.

A valve 6424 may be installed in the first recovery line 6421. The valve6424 may be provided as an on/off valve. The valve 6424 may be installedbetween the connection point of the first tank 610 and the firstrecovery line 6421 and the second point P2. The valve 6424 may bemaintained in an open state when the treatment liquid is recovered fromthe third nozzle 430 to the first tank 610. Alternatively, the valve6424 may be maintained in an open state when the treatment liquidremaining after being supplied from the third supply line 6413 to thethird nozzle 430 is recovered to the first tank 610. The valve 6241 maybe maintained in a closed state when the treatment liquid is notrecovered to the first tank 610. For example, the valve 6141 may bemaintained in a closed state when the treatment liquid is supplied fromthe second tank 620 to the third nozzle 430. Also, the valve 6141 may bemaintained in an open state when the treatment liquid is not suppliedfrom the second tank 620 to the third nozzle 430. The treatment liquidrecovered to the first tank 610 may be recovered through the thirdrecovery line 6423 and the first recovery line 6421 in sequence.

A valve 6425 may be installed in the second recovery line 6422. Thevalve 6425 may be provided as an on/off valve. The valve 6425 may beinstalled between the connection point of the second tank 620 and thesecond recovery line 6422 and the second point P2. The valve 6425 may bemaintained in an open state when the treatment liquid is recovered fromthe third nozzle 430 to the second tank 620. Alternatively, the valve6425 may be maintained in an open state when the treatment liquidremaining after being supplied from the third supply line 6413 to thethird nozzle 430 is recovered to the second tank 620. The valve 6245 maybe maintained in a closed state when the treatment liquid is notrecovered to the second tank 620. For example, the valve 6245 may bemaintained in a closed state when the treatment liquid is supplied fromthe first tank 610 to the third nozzle 430. Also, the valve 6145 may bemaintained in an open state when the treatment liquid is not suppliedfrom the first tank 610 to the third nozzle 430. The treatment liquidrecovered to the second tank 620 may be recovered through the thirdrecovery line 6423 and the second recovery line 6422 in sequence.

The liquid supply unit 600 may include a pump 643. The pump 643 may beinstalled on the third supply line 6413. The pump 643 may be installedat a position closer to the first point P1 than the connection points C1and C2 on the third supply line 6413. The pump 643 may be installed onthe third supply line 6413 between the first point P1 and the filter 644to be described later. The pump 643 may be installed between the firstpoint P1 and a heater module 700 to be described later on the thirdsupply line 6413. The pump 643 may provide power so that the treatmentliquid contained in the first tank 610 or the second tank 620 movesinside the supply line. For example, the pump 643 may be a decompressingpump. The pump 643 may provide decompressing force to the inside of thesupply line so that the treatment liquid may move inside the supplyline. The pump 643 may provide suction force inside the supply line sothat the treatment liquid may move inside the supply line. The pump 643may form negative pressure inside the supply line so that the treatmentliquid may move inside the supply line.

The liquid supply unit 600 may include a filter 644. The filter 664 maybe installed on the third supply line 6413. The filter 664 may beinstalled between the pump 643 and the connection points C1 and C2 onthe third supply line 6413. The filter 664 may be installed between thepump 643 and a flow meter 645 to be described later on the third supplyline 6413. The filter 644 may be installed between the heater module 700and the flow meter 645. Alternatively, the filter 644 may be installedbetween the pump 643 and the heater module 700. That is, the positionsof the filter 644 and the heater module 700 may be changed from eachother. The filter 644 may filter residual contaminants, particles, andthe like remaining in the treatment liquid before the treatment liquidis supplied to the nozzle 430.

The liquid supply unit 600 may include the heater module 700. The heatermodule 700 may be installed on the third supply line 6413. The heatermodule 700 may be installed between the pump 643 and the filter 644.Alternatively, the heater module 700 may be installed between the filter644 and the flow meter 645. The heater module 700 may heat the treatmentliquid flowing through the supply line to a temperature equal to orbelow the boiling point. For example, the heater module 700 may heat thetreatment liquid to about 77° C. The structure of the heater module 700will be described below.

The liquid supply unit 600 may include the flow meter 645. The flowmeter 645 may be installed on the third supply line 6413. The flow meter645 may be installed between the filter 644 and the connection points C1and C2. Alternatively, the flow meter 645 may be installed between theheater module 700 and the connection points C1 and C2. The flow meter645 may measure the flow rate of the treatment liquid flowing throughthe third supply line 6413. For example, the flow meter 645 may measurethe flow rate by measuring a change in unit area or a change in mass ofthe treatment liquid flowing through the third supply line 6413 perhour. However, the present invention is not limited thereto, and variousmethods for measuring the flow rate flowing through the third supplyline 6413 may be applied.

The liquid supply unit 600 may include a pressure sensor 646. Thepressure sensor 646 may be installed on the third recovery line 6423.The pressure sensor 646 may be installed between the connection pointsC1 and C2 and the second point P2. The pressure sensor 646 may beinstalled between a static pressure regulator 647 to be described laterand the second point P2. The pressure sensor 646 may sense the flowpressure of the organic solvent before the organic solvent is suppliedto the third nozzle 430. The first pressure sensor 664 may detect achange in the flow rate of the organic solvent passing through theinside of a sixth supply line 661 f. Alternatively, the pressure sensor646 may measure the pressure when the treatment liquid remaining afterbeing supplied to the third nozzle 430 flows the inside of the thirdrecovery line 6423.

The liquid supply unit 600 may include the static pressure regulator647. The static pressure regulator 647 may be installed on the thirdrecovery line 6423. The static pressure regulator 647 may be installedbetween the pressure sensor 646 and the second point P2. The staticpressure regulator 647 may adjust the pressure in the internalcirculation line 640 to be constantly maintained based on the pressurevalue measured by the pressure sensor 646.

The liquid supply unit 600 may include an internal circulation line 650.The internal circulation line 650 may circulate the treatment liquidcontained in the first tank 610. The internal circulation line 650 maycirculate the treatment liquid contained in the second tank 620. Theinternal circulation line 650 may adjust the temperature of thetreatment liquid while circulating the treatment liquid contained in thefirst tank 610 and/or the second tank 620.

The internal circulation line 650 may include a first lower circulationline 6511 connected to the lower wall of the first tank 610, a firstupper circulation line 6512 connected to an upper wall of the first tank610, and a shared line 6513 connecting the first lower circulation line6511 and the first upper circulation line 6512. A valve 6516 may beinstalled in the first lower circulation line 6511. The valve 6516 maybe provided as an on/off valve. The valve 6516 may maintain an openstate when the temperature of the treatment liquid contained in thefirst tank 610 is adjusted. For example, when the treatment liquid issupplied from the second tank 620 to the third nozzle 430, the valve6516 may maintain an open state. That is, when the valve 6414 on thefirst supply line 6411 is in a closed state and the valve 6415 on thesecond supply line 6412 is in an open state at the same time, the valve6516 on the first lower circulation line 6511 may be in an open state.The valve 6516 may maintain a closed state when the treatment liquidcontained in the first tank 610 is not circulated on the internalcirculation line 650. For example, when the treatment liquid is suppliedfrom the first tank 610 to the third nozzle 430, the valve 6516 maymaintain a closed state. That is, when the valve 6414 on the firstsupply line 6411 is in the open state and the valve 6415 on the secondsupply line 6412 is in the closed state at the same time, the valve 6516on the first lower circulation line 6511 may be in the closed state. Thetreatment liquid contained in the internal space 611 of the first tank610 may be circulated while sequentially flowing through the first lowercirculation line 6511, the shared line 6513, and the first uppercirculation line 6512.

The internal circulation line 650 may include a second lower circulationline 6514 connected to the lower wall of the second tank 620, a secondupper circulation line 6515 connected to the upper wall of the secondtank 620, and a shared line 6513 connecting the second lower circulationline 6514 and the second upper circulation line 6515. A valve 6517 maybe installed in the second lower circulation line 6514. The valve 6517may be provided as an on/off valve. The valve 6517 may maintain an openstate when the temperature of the treatment liquid contained in thesecond tank 620 is adjusted. For example, when the treatment liquid issupplied from the first tank 610 to the third nozzle 430, the valve 6517may maintain an open state. That is, when the valve 6414 on the firstsupply line 6411 is in an open state and the valve 6415 on the secondsupply line 6412 is a closed state, the valve 6511 on the second lowercirculation line 6511 may be in an open state. The valve 6517 maymaintain a closed state when the treatment liquid contained in thesecond tank 610 is not circulated on the internal circulation line 650.For example, when the treatment liquid is supplied from the first tank620 to the third nozzle 430, the valve 6517 may maintain a closed state.That is, when the valve 6414 on the first supply line 6411 is the closedstate and the valve 6415 on the second supply line 6412 is the openstate at the same time, the valve 6517 on the second lower circulationline 6514 may be in a closed state. The treatment liquid contained inthe internal space 621 of the second tank 620 may be circulated whilesequentially flowing through the second lower circulation line 6514, theshared line 6513, and the second upper circulation line 6515.

The first lower circulation line 6511 may meet the second lowercirculation line 6514 at a third point P3. The first upper circulationline 6512 may meet the second upper circulation line 6515 at a fourthpoint P4. The shared line 6513 may connect between the third point P3and the fourth point P4. A pump 6518 may be installed on the shared line6513. The pump 6518 may provide a reduced pressure on the internalcirculation line 650 to circulate the treatment liquid contained in thefirst tank 610 or the treatment liquid contained in the second tank 620.The pump 6518 may be provided as a decompressing pump. The pump 6518 maybe installed at a position closer to the third point P3 than the fourthpoint P4 on the shared line 6514. The pump 6518 may be installed betweenthe heater module 700 and the third point P3.

The heater module 700 may be installed on the shared line 6513. Theheater module 700 may adjust the temperature of the treatment liquidflowing through the internal circulation line 650. The heater module 700may heat the treatment liquid flowing through the internal circulationline 650. The heater module 700 may heat the treatment liquid flowingthrough the internal circulation line 650 to a temperature equal to orbelow the boiling point. For example, the heater module 700 may heat thetreatment liquid to about 77° C. The heater module 700 having the samestructure as the heater module 700 installed in the third supply line6413 may be installed in the shared line 6513. Hereinafter, thestructure of the heater module 700 will be described below.

The liquid supply unit 600 may include the heater module 700. The heatermodule 700 may increase the temperature of the treatment liquid to a settemperature.

FIG. 4 is a perspective view of the heater module according to theexemplary embodiment of the present invention, and FIG. 5 is across-sectional view of the heater module according to the exemplaryembodiment of the present invention.

The heater module 700 may include a pipe 710. The pipe 710 may have aninternal space through which the treatment liquid may flow. The pipe 710may be provided in a tubular shape having an open top and an openbottom. For example, the pipe 710 may have a cylindrical cross-section.However, the present invention is not limited thereto, and the pipe 710may have a cross-section in various shapes, such as a triangular shape,a square shape, and a polygonal shape.

The pipe 710 may include an upper cover 711 covering the upper opening.The upper cover 711 may be provided with an inflow member 712 to whichthe third supply line 6413 or the shared line 6513 is connected. Thetreatment liquid may be introduced into the internal space of the pipe710 through the inflow member 712. The pipe 710 may include a lowercover 713 covering the lower opening. The lower cover 713 may beprovided with an outflow member 714 to which the third supply line 6413or the shared line 6513 is connected. The treatment liquid may flow fromthe internal space of the pipe 710 to the third supply line 6413 or theshared line 6513 through the outflow member 714.

The pipe 710 may be made of a quartz material. However, the presentinvention is not limited thereto, and the pipe 710 may be made of amaterial having low heat capacity and/or a material having low heatconductivity. The internal space of the quartz pipe 710 may be providedas a flow path through which the treatment liquid passes. An innersurface 710 a of the pipe 710 made of quartz may be in direct contactwith the treatment liquid. A heating element 720 to be described latermay be provided on an outer surface 710 b of the pipe 710 made ofquartz. As the pipe 710 that is in direct contact with the treatmentliquid L is made of a quartz material with low heat capacity and lowthermal conductivity, when the substrate processing facility 1 or thesubstrate treating apparatus 300 is urgently stopped, the boilingphenomenon of the treatment liquid contained in the pipe 710 may beprevented.

The heater module 700 may include a heating element 720. The heatingelement 720 may be provided on the surface of the pipe 710. The heatingelement 720 may be provided on the outer surface 710 b of the pipe 710.The heating element 720 may be in contact with the outer surface 710 bof the pipe 710. The heating element 720 may be a heat source forheating the treatment liquid flowing through the pipe 710. The heatingelement 720 may be provided as a heating wire. The heating element 720may be provided as a resistor. The heating element 720 may be providedon the outer surface 710 b of the pipe 710 in a printing manner.

The heating element 720 is in contact with the outer surface 710 b ofthe pipe 710, and may include a first portion 721 extending in thelongitudinal direction of the pipe 710, a second portion 722 extendingupwardly from at least a portion of the first portion 721, and a thirdportion 723 extending from the second portion 722 in the longitudinaldirection of the pipe 710. The first portion 721 of the heating element720 and the third portion 723 of the heating element 720 may be formedto have a step. A conductor terminal 730 to be described later may bedisposed under the third portion 723 of the heating element 720. Thesecond portion 722 of the heating element 720 may be in contact with oneend of the conductor terminal 730. The third portion 723 of the heatingelement 720 may overlap at least a portion of the conductor terminal 730in a direction perpendicular to the longitudinal direction of the pipe710. The third portion 723 of the heating element 720 may be in contactwith at least a portion of the conductor terminal 730. The third portion723 of the heating element 720 may be in contact with the surface of atleast a portion of the conductor terminal 730.

The heating element 720 may be made of a metal material. The heatingelement 720 may be made of AgPd or graphite.

The heater module 700 may include a temperature sensor (not illustrated)capable of measuring the temperature of the heating element 720.

The heater module 700 may include the conductor terminal 730. Theconductor step 730 may be provided on the outer surface 710 b of thepipe 710. The conductor terminal 730 may contact the outer surface 710 bof the pipe 710. The conductor terminal 730 may be formed to extendalong the longitudinal direction of the pipe 710 on the outer surface710 b of the pipe 710. At least a portion of the conductor terminal 730may be in contact with the heating element 720. At least a portion ofthe conductor terminal 730 may be provided under the third portion 723of the heating element 720, and may be in contact with the third portion723 of the heating element 720. One end of the conductor terminal 730may be in contact with the second portion 722 of the heating element720. The conductor terminal 730 may be made of a metal material. Forexample, the conductor terminal 730 may be made of silver (Ag). Aterminal block 740 may be disposed on the conductor terminal 730. Theconductor terminal 730 and the terminal block 740 may be coupled by aconductive adhesive 750. The conductor terminal 730 and the terminalblock 740 may be electrically connected through a conductive adhesive750. The conductive adhesive 750 may be provided as a silver paste (Agsintering).

The heater module 700 may include the terminal block 740. The terminalblock 740 may receive power from an external power source. The terminalblock 740 may be coupled to the conductor terminal 730. The terminalblock 740 is electrically connected to the conductor terminal 730 by theconductive adhesive 750. power applied to the terminal block 740 may betransmitted to the conductor terminal 730 through the conductiveadhesive 750, power transmitted to the conductor terminal 730 istransmitted to the heating element 720 by the contact portion betweenthe conductor terminal 730 and the heating element 720, and the heatingelement 720 may be heated by the received power.

The heater module 700 may include an insulator 760. The insulator 760may be provided on the heating element 720. The insulator 760 may beprovided to cover the exposed portion of the heating element 720. Theinsulator 760 may cover a contact portion between the heating element720 and the conductor terminal 730. The insulator 760 may include afirst insulating portion 761 covering the first portion 721 of theheating element 720, a second insulating portion 762 covering the thirdportion 723 of the heating element 720, a third insulating portion 763connecting the first insulating portion 761 and the second insulatingportion 762 and covering the second portion 722 of the heating element720, and a fourth insulating portion 764 covering an end of the thirdportion 723 of the heating element 720. The insulator 760 may be formedof silicon dioxide (SiO₂). The insulator 760 may be provided to coverthe exposed portion of the heating element 720 so that power transmittedto the heating element 720 and/or heat generated from the heatingelement 720 are not transmitted to other portions. Through this, loss ofheat generated by the heating element 720 may be prevented. In addition,the insulator 760 may protect the heating element 720. The insulator 760may prevent the exposed portion of the heating element 720 from beingoxidized by external air.

In the exemplary embodiment of the present invention, by providing theheating element 720 on the outer surface 710 b of the pipe 710 throughwhich the treatment liquid flows therein, the heat transfer path fromthe heating element 720 to the treatment liquid L may be minimized,thereby increasing temperature increasing efficiency. Through this,there is an effect of shortening the preparation time of the treatmentliquid L, improving productivity, and reducing power consumption. Inaddition, even when the facility is urgently stopped, since the heattransfer path is short and the heat latent in the heater module 700 issmall, the boiling phenomenon of the treatment liquid L may beprevented. In addition, as the pipe 710 that is in direct contact withthe treatment liquid L is made with a quartz material that is chemicallystable and has inert properties, it is possible to prevent damage to thepipe 710 by the heating element 720 that is a heat source. In this case,since the metal particulates generated from the metal heating element720 do not penetrate into the internal space of the pipe 710,contamination of the treatment liquid L due to the metal particulatesmay be prevented. Therefore, compared to a heater module using afluororesin-based pipe, the content of particles in the treatment liquidL is small, so that the process yield may be increased.

The controller 900 may control the overall operation of the substrateprocessing facility 1. The controller 900 may include a CentralProcessing Unit (CPU), Read Only Memory (ROM), and Random Access Memory(RAM). The CPU executes desired processing, such as liquid processingand drying processing, which will be described later, according tovarious recipes stored in these storage areas. In the recipe, processtime, process pressure, press temperature, various gas flow rates, andthe like, which are control information of the apparatus for processconditions, are input. In addition, recipes indicating these programsand processing conditions may be stored in a hard disk or semiconductormemory. In addition, the recipe may be set at a predetermined positionin the storage area while being accommodated in a portablecomputer-readable storage medium such as a CD-ROM or DVD.

FIG. 6 is a diagram schematically illustrating a process in which atreatment liquid is supplied from the first tank to the nozzle accordingto the exemplary embodiment of the present invention, and FIG. 7 is adiagram schematically illustrating a process in which a treatment liquidis supplied from the second tank to the nozzle according to theexemplary embodiment of the present invention.

The controller 900 may control the liquid supply unit 600. Thecontroller 900 may control the valves included in the liquid supply unit600. The controller 900 may control whether to open and close the valvesincluded in the liquid supply unit 600.

Referring to FIG. 6 , the valve 6414 of the first supply line 6411 andthe valve 6424 of the first recovery line 6421 are maintained in an openstate, and the valve 6415 of the second supply line 6412 and the valve6425 of the second recovery line 6422 are maintained in a closed state.In this case, the treatment liquid L contained in the first tank 610 issupplied to the third nozzle 430 by sequentially passing through thefirst supply line 6411, the third supply line 6413, and the connectionlines 661 and 662. The treatment liquid L is heated by the heater module700 while flowing through the third supply line 6413 to be supplied tothe third nozzle 430. Among the treatment liquid L flowing in the thirdsupply line 6413, the remaining treatment liquid L not supplied to thethird nozzle 430 sequentially passes through the third recovery line6423 and the first recovery line 6421 and is introduced into theinternal space 611 of the first tank 610. Meanwhile, when the treatmentliquid L is supplied from the first tank 610 to the third nozzle 430,the treatment liquid L contained in the second tank 620 is circulatedalong the internal circulation line 650 and is heated. At this time, thevalve 6516 on the first lower circulation line 6511 is maintained in theclosed state, and the valve 6517 on the second lower circulation line6514 is maintained in the open state.

When the amount of treatment liquid L contained in the first tank 610falls below a certain water level, the supply of the treatment liquid Lin the first tank 610 is stopped, and the treatment liquid L is suppliedfrom the second tank 620. The liquid supply source 630 supplies thetreatment liquid L to the first tank 610, and the treatment liquid Lfilled in the first tank 610 is heated through the internal circulationline 650 while the treatment liquid L is supplied from the second tank620 to the third nozzle 430.

Referring to FIGS. 7, 7 , the valve 6415 of the second supply line 6412and the valve 6425 of the second recovery line 6422 are maintained in anopen state, and the valve 6414 of the first supply line 6411 and thevalve 6424 of the first recovery line 6421 are maintained in a closedstate. In this case, the treatment liquid L contained in the second tank620 is supplied to the third nozzle 430 by sequentially passing throughthe second supply line 6412, the third supply line 6413, and theconnection lines 661 and 662. The treatment liquid L is heated by theheater module 700 while flowing through the third supply line 6413 to besupplied to the third nozzle 430. Among the treatment liquid L flowingin the third supply line 6413, the remaining treatment liquid L notsupplied to the third nozzle 430 sequentially passes through the thirdrecovery line 6423 and the second recovery line 6422 and is introducedinto the internal space 611 of the second tank 620. Meanwhile, when thetreatment liquid L is supplied from the second tank 610 to the thirdnozzle 430, the treatment liquid L contained in the first tank 610 iscirculated along the internal circulation line 650 and is heated. Inthis case, the valve 6517 on the second lower circulation line 6514 ismaintained in the closed state, and the valve 6516 on the first lowercirculation line 6511 is maintained in the open state.

In the above description, it has been described that the liquid supplyunit 600 is a supply system for supplying isopropyl alcohol (IPA) to thesubstrate W, but the present invention is not limited thereto. Theliquid supply unit 600 may be applied to any supply system that suppliesa high-temperature treatment liquid among the treatment liquids suppliedto the substrate W. For example, the treatment liquid may be provided asa chemical, such as sulfuric acid or phosphoric acid.

The foregoing detailed description illustrates the present invention.Further, the above content illustrates and describes the exemplaryembodiment of the present invention, and the present invention can beused in various other combinations, modifications, and environments.That is, the foregoing content may be modified or corrected within thescope of the concept of the invention disclosed in the presentspecification, the scope equivalent to that of the disclosure, and/orthe scope of the skill or knowledge in the art. The foregoing exemplaryembodiment describes the best state for implementing the technicalspirit of the present invention, and various changes required in thespecific application field and use of the present invention arepossible. Accordingly, the detailed description of the invention aboveis not intended to limit the invention to the disclosed exemplaryembodiment. Further, the accompanying claims should be construed toinclude other exemplary embodiments as well.

What is claimed is:
 1. An apparatus for treating a substrate, theapparatus comprising: a chamber having a processing space; a supportunit for supporting and rotating the substrate in the processing space;a nozzle for supplying a high-temperature treatment liquid to thesubstrate supported by the support unit; and a liquid supply unit forsupplying the high-temperature treatment liquid to the nozzle, whereinthe liquid supply unit includes: a tank for storing the treatmentliquid; a main circulation line for supplying the treatment liquid froman internal space of the tank to the nozzle or for recovering thetreatment liquid to the internal space of the tank; and a connectionline connected to the main circulation line to supply the treatmentliquid to the nozzle, and a heater module for heating the treatmentliquid to a predetermined temperature is installed in the maincirculation line, and the heater module includes: a pipe in which thetreatment liquid flows and which is made of a quartz material; and aheating element provided on a surface of the pipe.
 2. The apparatus ofclaim 1, wherein the heating element is provided on the surface of thepipe in a printing manner.
 3. The apparatus of claim 1, wherein theheater module includes a conductor terminal provided on the surface ofthe pipe, and a terminal block which is coupled onto the conductorterminal and receives power from the outside, and at least a portion ofthe conductor terminal is in contact with the heating element.
 4. Theapparatus of claim 3, wherein the heating element includes a firstportion extending in a longitudinal direction of the pipe while being incontact with the surface of the pipe, a second portion extendingupwardly from the first portion, and a third portion extending in thelongitudinal direction of the pipe from the second portion, the secondportion is in contact with one end of the conductor terminal, and thethird portion is in contact with the surface of the conductor terminal.5. The apparatus of claim 4, wherein the heater module includes theheating element and an insulator covering an exposed portion of theheating element.
 6. The apparatus of claim 3, wherein the conductorterminal and the terminal block are electrically connected through aconductive adhesive.
 7. The apparatus of claim 6, wherein the heatingelement and the conductor terminal are made of metal.
 8. The apparatusof claim 7, wherein the heating element is made of AgPd or graphite, theconductor terminal is made of with silver (Ag), and the conductiveadhesive is provided as a silver paste (Ag sintering).
 9. The apparatusof claim 5, wherein the insulator is made of silicon dioxide (SiO₂). 10.The apparatus of claim 1, wherein the main circulation line includes asupply line for supplying the treatment liquid stored in the internalspace of the tank to the nozzle, and a recovery line for recovering thetreatment liquid from the nozzle to the tank, and the heater module isinstalled in the supply line.
 11. The apparatus of claim 1, wherein theheater module includes a temperature sensor for measuring a temperatureof the heating element.
 12. The apparatus of claim 1, wherein the liquidsupply unit includes an internal circulation line for circulating thetreatment liquid stored in the internal space of the tank, and theheater module is installed in the internal circulation line.
 13. Theapparatus of claim 1, wherein the treatment liquid is provided asisopropyl alcohol (IPA).
 14. A liquid supply unit for supplying atreatment liquid to a nozzle that discharges the treatment liquid to asubstrate, the liquid supply unit comprising: a tank for storing thetreatment liquid; a main circulation line for supplying the treatmentliquid from an internal space of the tank to the nozzle or forrecovering the treatment liquid to the internal space of the tank; asupply line connected to the main circulation line to supply thetreatment liquid to the nozzle; and a heater module installed in themain circulation line and heating the treatment liquid flowing throughthe main circulation line to a predetermined temperature, wherein theheater module includes: a pipe in which the treatment liquid flows andwhich is made of a quartz material; and a heating element provided on asurface of the pipe.
 15. The liquid supply unit of claim 14, wherein theheater module includes a conductor terminal provided on the surface ofthe pipe, and a terminal block which is coupled onto the conductorterminal and receives power from the outside, and at least a portion ofthe conductor terminal is in contact with the heating element.
 16. Theliquid supply unit of claim 15, wherein the conductor terminal isprovided on the surface of the pipe in a cylindrical printing manner,and the conductor terminal and the terminal block are electricallyconnected through a conductive adhesive.
 17. The liquid supply unit ofclaim 15, wherein the heating element includes a first portion extendingin a longitudinal direction of the pipe while being in contact with thesurface of the pipe, a second portion extending upwardly from the firstportion, and a third portion extending in the longitudinal direction ofthe pipe from the second portion, the second portion is in contact withone end of the conductor terminal, and the third portion is in contactwith the surface of the conductor terminal.
 18. The liquid supply unitof claim 15, wherein the heater module includes the heating element andan insulator covering a contact portion between the heating element andthe conductor terminal.
 19. An apparatus for treating a substrate, theapparatus comprising: a chamber having a processing space; a supportunit for supporting and rotating the substrate in the processing space;a nozzle for supplying a high-temperature treatment liquid to thesubstrate supported by the support unit; and a liquid supply unit forsupplying the high-temperature treatment liquid to the nozzle, whereinthe liquid supply unit includes: a first tank and a second tank forstoring the treatment liquid; a main circulation line for connecting thefirst tank and the second tank and supplying the treatment liquid to thenozzle or recovering the treatment liquid to an internal space of thefirst tank or an internal space of the second tank; and an internalcirculation line for connecting the first tank and the second tank andheating the treatment liquid contained in the internal space of thefirst tank or the internal space of the second tank, the maincirculation line includes a supply line branched from the maincirculation line and supplying the treatment liquid to the nozzle, and arecovery line branched from the main circulation line and recovering thetreatment liquid from the nozzle to the first tank or the second tank,the inner circulation line includes a lower circulation line connectinga lower wall of the first tank and a lower wall of the second tank, anupper circulation line connecting an upper wall of the first tank and anupper wall of the second tank, and a shared line connecting the lowercirculation line and the upper circulation line, a heater module forheating the treatment liquid flowing therein to a predeterminedtemperature is installed in each of the supply line of the maincirculation line and the shared line of the internal circulation line,and the heater module includes: a pipe in which the treatment liquidflows and which is made of a quartz material; a heating element providedon a surface of the pipe in a printing manner; a conductor terminalwhich is provided on the surface of the pipe in a printing manner, andat least a portion of which is in contact with the heating element; anda terminal block which is coupled onto the conductor terminal through aconductive adhesive and receives power from the outside.
 20. Theapparatus of claim 19, wherein the heater module includes an insulatorcovering an exposed portion of the heating element.